Pedestal of heat insulating cylinder for manufacturing semiconductor wafers



FIG. 1 is front perspective view of a pedestal of heat insulatingcylinder for manufacturing semiconductor wafers illustrating my newdesign;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken through line 8—8 of FIG. 2;

FIG. 9 is a cross-sectional view taken through line 9—9 of FIG. 2; and,

FIG. 10 is a front perspective view of a pedestal of heat insulatingcylinder for manufacturing semiconductor wafers in use.

The broken lines are shown for illustrative purposes only and form nopart of the claimed design.

The ornamental design for a pedestal of heat insulating cylinder formanufacturing semiconductor wafers, as shown and described.